Hybrid Integration of Screen-Printed RFID Tags and Rigid Microchip on Paper
نویسندگان
چکیده
Hybrid or heterogeneous integration of silicon technologies and printed electronics is a promising approach for high-performance flexible electronics. It essentially the rigid microchips with circuit on substrate. However, no-lead millimeter-size pitch introduce practical challenges in terms precise electrical bonding onto pattern. The differences mechanical thermal requirements also make it challenging to use conventional interconnect technology robustly connect substrates. focus this work present these respect different substrate–adhesive combinations provide facile technique integrating near-field communication (NFC) Following successful integration, smart tags were characterized demonstrate reliable performance NFC reading range. While presenting hybrid tag, shows potential solution several other applications where high cannot be achieved by alone.
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ژورنال
عنوان ژورنال: IEEE journal on flexible electronics
سال: 2022
ISSN: ['2768-167X']
DOI: https://doi.org/10.1109/jflex.2022.3165515